JPH073634Y2 - ウェハ液洗乾燥装置 - Google Patents

ウェハ液洗乾燥装置

Info

Publication number
JPH073634Y2
JPH073634Y2 JP1987197637U JP19763787U JPH073634Y2 JP H073634 Y2 JPH073634 Y2 JP H073634Y2 JP 1987197637 U JP1987197637 U JP 1987197637U JP 19763787 U JP19763787 U JP 19763787U JP H073634 Y2 JPH073634 Y2 JP H073634Y2
Authority
JP
Japan
Prior art keywords
wafer
carrier
liquid washing
washing tank
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987197637U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01104022U (en]
Inventor
保夫 谷田部
正彦 林
利夫 片岡
Original Assignee
株式会社トムコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社トムコ filed Critical 株式会社トムコ
Priority to JP1987197637U priority Critical patent/JPH073634Y2/ja
Priority to US07/289,833 priority patent/US4899768A/en
Publication of JPH01104022U publication Critical patent/JPH01104022U/ja
Application granted granted Critical
Publication of JPH073634Y2 publication Critical patent/JPH073634Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1987197637U 1987-12-28 1987-12-28 ウェハ液洗乾燥装置 Expired - Lifetime JPH073634Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987197637U JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置
US07/289,833 US4899768A (en) 1987-12-28 1988-12-27 Wafer washing and drying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987197637U JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置

Publications (2)

Publication Number Publication Date
JPH01104022U JPH01104022U (en]) 1989-07-13
JPH073634Y2 true JPH073634Y2 (ja) 1995-01-30

Family

ID=16377799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987197637U Expired - Lifetime JPH073634Y2 (ja) 1987-12-28 1987-12-28 ウェハ液洗乾燥装置

Country Status (2)

Country Link
US (1) US4899768A (en])
JP (1) JPH073634Y2 (en])

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0134962B1 (ko) * 1989-07-13 1998-04-22 나까다 구스오 디스크 세척장치
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
CA2040989A1 (en) * 1990-05-01 1991-11-02 Ichiro Yoshida Washing/drying method and apparatus
JP3162704B2 (ja) * 1990-11-28 2001-05-08 東京エレクトロン株式会社 処理装置
US5246528A (en) * 1991-05-31 1993-09-21 Shin-Etsu Handotai Co., Ltd. Automatic wafer etching method and apparatus
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist
US6239038B1 (en) 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
TW310452B (en]) * 1995-12-07 1997-07-11 Tokyo Electron Co Ltd
US6125862A (en) * 1996-10-02 2000-10-03 Sankyo Seiki Mfg. Co., Ltd. Cleaning apparatus
US5815942A (en) * 1996-12-13 1998-10-06 Kabushiki Kaisha Toshiba Vapor drying system and method
US6136724A (en) * 1997-02-18 2000-10-24 Scp Global Technologies Multiple stage wet processing chamber
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
KR101058835B1 (ko) * 2009-07-10 2011-08-23 에이펫(주) 웨이퍼 건조장치 및 이를 이용한 웨이퍼 건조방법
ITMI20110646A1 (it) * 2011-04-15 2012-10-16 St Microelectronics Srl Apparecchiatura per la lavorazione di wafer semiconduttori, in particolare per realizzare una fase di processo di rimozione di polimeri.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3106927A (en) * 1962-01-15 1963-10-15 Madwed Albert Vapor chamber-tank unit
US4282825A (en) * 1978-08-02 1981-08-11 Hitachi, Ltd. Surface treatment device
JPS58200540A (ja) * 1982-05-19 1983-11-22 Hitachi Ltd 半導体ウエハの洗浄方法
JPS6059747A (ja) * 1983-09-12 1985-04-06 Mitsubishi Electric Corp 半導体ウエ−ハの処理装置
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US4736758A (en) * 1985-04-15 1988-04-12 Wacom Co., Ltd. Vapor drying apparatus
US4736759A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning rinsing and drying substrates
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
JPS63208223A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd ウエハ処理装置

Also Published As

Publication number Publication date
JPH01104022U (en]) 1989-07-13
US4899768A (en) 1990-02-13

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